Polished edge of a 28 nm chip die under magnification

Physics and models

Established physics, with its limits on the page.

Greater Today TCAD solves 2D drift-diffusion with the open-source DEVSIM engine. Here is what it models, what it measures, and — just as important — what it does not model yet.

Devices

What you can simulate today.

TemplateDeviceNotes
gan_hemtAlGaN/GaN HEMTPolarisation-induced 2DEG at the AlGaN/GaN interface; GaN uses an electron quasi-Fermi-potential formulation that stays robust in high-voltage off-state.
si_nmosSilicon NMOSElectron and hole densities solved directly.
customYour own 2D deviceRectangular regions, boundary contacts, uniform and Gaussian doping, and DC sweeps written as an input deck.

Analyses

Sweeps

opOperating point at a fixed bias
idvgTransfer characteristic, one curve per drain bias
idvdOutput characteristic
offstateOff-state field, used for the breakdown estimate

Metrics

Extracted figures

vth_lin · vth_ccThreshold voltage, linear and constant-current
gm_maxPeak transconductance
ssSubthreshold swing
ion · ioff · on_off_ratioOn and off current and their ratio
ronOn-resistance
ns_gate · ns_access2DEG sheet density under the gate and in the access region
vbr_estBreakdown estimate (see limits below)

The solver

Drift-diffusion, solved properly.

Poisson's equation and the electron and hole continuity equations are solved together on a 2D mesh with Newton's method, using the open-source DEVSIM engine.

  • Heterojunctions via a band-corrected Scharfetter–Gummel discretisation
  • Caughey–Thomas velocity saturation on a constant low-field mobility
  • Shockley–Read–Hall recombination
  • Deep acceptor traps for semi-insulating GaN buffers
  • Ohmic, Schottky and MOS gate contacts
  • AlGaN/GaN polarisation as a fixed sheet charge, pol(x)
A chip die photographed in infrared light

Materials

Eleven built-in materials, and your own.

All material parameters live in one library. Copy any entry to make your own; each run stores a snapshot of the materials it used.

MaterialTypeTypical use
SiSemiconductorMOSFET channels and substrates
GeSemiconductorHigh-mobility channels
GaAsSemiconductorIII–V devices
4H-SiCSemiconductorWide-bandgap power devices
GaNSemiconductorHEMT channels and buffers
AlNSemiconductorNucleation and spacer layers
AlGaNAlloyHEMT barriers, with mole fraction comp=
SiO₂InsulatorGate oxides
Si₃N₄InsulatorPassivation and gate dielectrics
Al₂O₃InsulatorHigh-k gate dielectrics, MIS-HEMTs
HfO₂InsulatorHigh-k gate dielectrics

A custom semiconductor needs permittivity, electron affinity, bandgap, effective densities of states, electron mobility and saturation velocity; other transport properties have documented defaults. Design searches use Bayesian optimisation (TPE).

Known model limits

What the models don't do yet.

We publish these because a device engineer needs them to judge any number the tool produces.

  • Classical 2DEG. No Schrödinger–Poisson quantisation, so the carrier peak sits at the interface.
  • No self-heating or contact resistance. This is why the simulated HEMT peak current, around 2.2 A/mm, is above typical measured values. It is the first item for calibration.
  • Breakdown is an estimate. vbr_est is the drain bias at which the electron impact-ionisation integral along the channel reaches 1, post-processed from the off-state field. Avalanche carriers are not fed back, and field plates are not modelled yet.
  • Simple mobility. No surface-roughness or doping-dependent mobility yet.
  • Compensated HEMT surface. Polarisation charge at the AlGaN surface is assumed compensated by surface donors.
  • Static buffer traps. Traps follow the conduction band only — no transients or current collapse.
  • An open convergence issue. The full NMOS example sweep fails to converge near −0.4 V. Completed points are kept and the run is marked partial.
Validation status. Results have not yet been calibrated or benchmarked against measured devices. Treat them as tools for exploration, not as predictions of fabricated hardware. See what we have checked so far.

Working on GaN or silicon devices?

We're opening the private beta to a small number of labs and teams. Tell us what you simulate.